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E2E0014-38-93 Semiconductor
Semiconductor MSM6408
High speed and High performance 4-Bit Microcontroller
This version: Sep. 1998 MSM6408 Previous version: Mar. 1996
GENERAL DESCRIPTION
The MSM6408 microcontroller is a low-power, single-chip device implemented in complementary metal-oxide semiconductor technology. The MSM6408 is optimized for high-speed processing and complicated-control applications, in which conventional microcontrollers are difficult to use.
FEATURES
* Mask ROM : 8096 words 8 bits * RAM (including the stack area) : 256 words 4 bits * I/O port Input-output port : 8 ports 4 bits Input port : 1 port 4 bits 4 bits are for input ports having a latch; the other 32 bits are for input/output ports that allow bit manipulation * Three built-in counters : 12-bit time-base counter 12-bit programmable timer 8-bit high-speed programmable timer/event counter * Built-in 8-bit serial I/O register (with 3-bit counter) * Five interrupts with five priority levels (4 internal, 1 external) * 32 stack levels (in RAM) * Power down features * Minimum instruction execution time : 1.0 ms @ 4.0 MHz clock * Instruction systems suitable for control * Fully static operation * Low power consumption * Single 5 V power supply * Package options: 42-pin plastic DIP (DIP42-P-600-2.54) (Product name : MSM6408-RS) 44-pin plastic QFP (QFP44-P-910-0.80-K) (Product name : MSM6408-GS-K) 44-pin plastic QFP (QFP44-P-910-0.80-2K) (Product name : MSM6408-GS-2K) indicates a code number.
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Semiconductor
MSM6408
BLOCK DIAGRAM
RAM 16 16 4 bits DEC SP H L C ALU F 12 ROM 8096 8 bits DEC PC 0
ACC
INSTR DEC
12-bit Timer P9 8-bit T/C PA 8-bit SR
Interrupt PC INTE Control PD IRQ 12-bit TBC
PB Timing & Control OSC0 OSC1 TEST RESET VDD GND
P8
P7
P6
P5
P4
P3
P2
P1
P0
3 210 3 210 3 210 3 210 3 210 3 210 3 210 3 210 3 210 INT SCK, CTO, CLK SO TCK SI CIN TMO
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Semiconductor
MSM6408
PIN CONFIGURATION (TOP VIEW)
P4.0 P4.1 P4.2 P4.3 P3.0 P3.1 P3.2 P3.3 OSC0
1 2 3 4 5 6 7 8 9
42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22
VDD P5.3 P5.2 P5.1 P5.0 P6.3 P6.2 P6.1 P6.0 P7.3 P7.2 P7.1 P7.0 P8.3 P8.2 P8.1 P8.0 P1.3 P1.2 P1.1 P1.0
OSC1 10 RESET 11 TEST 12 P2.0 13 P2.1 14 P2.2 15 P2.3 16 P0.0 17 P0.1 18 P0.2 19 P0.3 20 GND 21
42-Pin Plastic DIP
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Semiconductor
MSM6408
PIN CONFIGURATION (TOP VIEW) (continued)
44 P3.0 43 P4.3 42 P4.2 41 P4.1 40 P4.0 38 P5.3 37 P5.2 36 P5.1 35 P5.0 34 P6.3 39 VDD
P3.1 P3.2 P3.3 OSC0 OSC1 RESET TEST P2.0 P2.1
1 2 3 4 5 6 7 8 9
33 P6.2 32 P6.1 31 P6.0 30 NC 29 P7.3 28 P7.2 27 P7.1 26 P7.0 25 P8.3 24 P8.2 23 P8.1
P0.0 12 P0.1 13 P0.2 14 P0.3 15 GND 16 NC 17 P1.0 18 P1.1 19 P1.2 20 P1.3 21 P8.0 22
P2.2 10 P2.3 11
NC : No-connection pin 44-Pin Plastic QFP
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Semiconductor
MSM6408
PIN DESCRIPTIONS
Symbol P0.0 P0.1/SCK P0.2/SO P0.3/SI P1.0/CIN P1.1/TMO P1.2/TCK P1.3 P2.0/INT P2.1 P2.2 P2.3 P3.0 to 3.3 P4.0 to 4.3 P5.0 to 5.3 P6.0 to 6.3 P7.0 to 7.3 P8.0 to 8.3 OSC0 OSC1 TEST RESET VDD GND
I/O I/O I/O I/O I/O I/O I O O I I/O I/O
Type
Description P0.1 is shared with serial clock (SLK) input/output. P0.2 is shared with serial data (SO) output. P0.3 is shared with serial data (SI) input. P1.0 is shared with counter input (CIN). P1.1 is shared with timer output (TMO). P1.2 is shared with timer clock input (TCK). P2.0 is shared with external interrupt input (INT).
During reset
"1"
"1"
The latch is Input ports with a latch, with built-in pull-up resistor. -- -- -- -- -- -- Crystal connection pins for clock oscillation. (Test pin for manufacturer) Input pin for system reset. Power supply voltage pins. reset. "1" "0" "0" "0" "0" "0" Oscillation waveform Pulse output -- --
I
--
Note: 1. The pins except for pins P2.0 to P2.3 are pseudo bidirectional ports. 2. When each port is used for output, the MSM6408 can drive one TTL (one input).
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Semiconductor
MSM6408
INSTRUCTION LIST
Mnemonic LAI n LLI n LHLI nn LMI nn LAL LLA LAH LHA LAM LMA
Load, Push, Pop
Code 9n 8n 15nn 14nn 21 2D 22 2E 38 2F 24 25 26 27 39-3B 10mm 11mm 19mm 3E59 3E51 3E5A 3E52 3E50 1C 1D 28 29-2B 3C 2C 30 33 31
Byte 1 1 2 2 1 1 1 1 1 1 1 1 1 1 1 2 2 2 2 2 2 2 2 1 1 1 1 1 1 1 1 1
Cycle 1 1 2 2 1 1 1 1 1 1 1 1 1 1 1 2 2 3 2 2 2 2 2 3 3 1 1 1 1 1 1 1 An Ln HLnn M(w)nn AL LA AH HA AM MA
Description
LAM+ LAM- LMA+ LMA- LAMM n2 LAMD mm LMAD mm LMTD mm LMCT LCTM LMSR LSRM LTMM PUSH POP X XM n2 X+ X- INA INM INL
AM, LL + 1,Skip if L = 0 AM, LL - 1,Skip if L = F MA, LL + 1,Skip if L = 0 MA, LL - 1,Skip if L = F AM, HH n2 AMd MdA Md(w)T (M(w), A), T = ROM table M(w)CT CTM(w) M(w)SR SRM(w) TM(M(w), A) STC, A, H, L, SPSP - 4 C, A, H, L, ST SPSP + 4 AM AM, HH n2 AM, LL+1, Skip if L = 0 AM, LL-1, Skip if L = F AA + 1, Skip if A = 0 AM + 1, Skip if M = 0 LL + 1, Skip if L = 0
Increment/
Decrement
Exchange
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Semiconductor
MSM6408
INSTRUCTION LIST (continued)
Mnemonic
Increment/Decrement
Code 32 12mm 34 37 35 36 13mm 02 01 03 3E4n 06 0A 0D 05 04 0B 0C 0E 0F 09 07 08 3E0n 3E2n 17pn 3E1n 16 54-57 64-67 74-77 58-5B 68-6B
Byte 1 2 1 1 1 1 2 1 1 1 2 1 1 1 1 1 1 1 1 1 1 1 1 2 2 2 2 1 1 1 1 1 1
Cycle 1 2 1 1 1 1 2 1 1 1 2 1 1 1 1 1 1 1 1 1 1 1 1 2 2 2 2 1 1 1 1 1 1
Description HH + 1, Skip if M = 0 MdMd + 1, Skip if Md = 0 AA - 1, Skip if A = F MM - 1, Skip if M = F LL - 1, Skip if L = F HH - 1, Skip if H = F MdMd - 1, Skip if Md = F AA + M, Skip if Cy = 1 A, CA + M + C, Skip if Cy =1 A, CA + M + C AA + n, Skip if Cy = 1 AA + 6 AA + 10 AA M AA M AA M AA AA + 1 Rotate left with C Rotate right with C Skip if C = 1 C1 C0 Skip if A = n Skip if L = n Skip if Pp = n Skip if M = n Skip if A = M Skip if Abit (n2) = 1 Abit (n2)0 Abit (n2)1 Skip if Mbit (n2) = 1 Mbit (n2)0
INH INMD mm DCA DCM DCL DCH DCMD mm ADS ADCS ADC AIS n DAA DAS AND OR EOR CMA CIA RAL RAR TC SC RC CAI n
Arithmetic Compare Bit manipulation
CLI n CPI p, n CMI n CAM TAB n2 RAB n2 SAB n2 TMB n2 RMB n2
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Semiconductor
MSM6408
INSTRUCTION LIST (continued)
Mnemonic SMB n TFB n2 RFB n2 Bit manipulation SFB n2 TPB n2 RPB n2 SPB n2 TPBD pn2 RPBD pn2 SPBD pn2 MEI MDI EITB EITM EICT EIEX DITB DITM DICT DIEX TITB Interrupt TITM TICT TIEX TQEX TQTB TQTM TQCT TQSR RQEX RQTB RQTM RQCT RQSR Code 78-7B 5C-5F 6C-6F 7C-7F 50-53 60-63 70-73 30 p0-3 3D p4-7 3D p8-B 3E60 3E61 3DC9 3DCA 3DCB 3DC8 3DC5 3DC6 3DC7 3DC4 3DC1 3DC2 3DC3 3DC0 3D20 3DD0 3DD1 3DD2 3DD3 3D24 3DD4 3DD5 3DD6 3DD7 Byte 1 1 1 1 1 1 1 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 Cycle 1 1 1 1 1 1 1 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 Mbit (n2)1 Skip if Fbit (n2) = 1 Fbit (n2)0 Fbit (n2)1 Skip if Pbit (n2) = 1 Pbit (n2)0 Pbit (n2)1 Skip if Ppbit (n2) = 1 Ppbit (n2) = 0 Ppbit (n2) = 1 MEIF1 MEIF0 EITBF1 EITMF1 EICTF1 EIEXF1 EITBF0 EITMF0 EICTF0 EIEXF0 Skip if EITBF = 1 Skip if EITMF = 1 Skip if EICTF = 1 Skip if EIEXF = 1 Skip if IRQEX = 1 Skip if IRQTB = 1 Skip if IRQTM = 1 Skip if IRQCT = 1 Skip if IRQSR = 1 IRQ EX0 IRQ TB0 IRQ TM0 IRQ CT0 IRQ SR0 Description
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Semiconductor
MSM6408
INSTRUCTION LIST (continued)
Mnemonic
Counter/Shift register control
Code 3DBB 3DBA 3DB7 3DB6 3DB3 3DB2 C0-FF 4a12 3F Ba Aa12 IE IF IA IB 20 3DpD 23 3DpC 00 3DB8 3DB9
Byte 2 2 2 2 2 2 1 2 3 1 2 1 1 1 1 1 2 1 2 1 2 2
Cycle 2 2 2 2 2 2 1 2 4 4 4 4 4 1 2 1 2 1 2 1 2 2
Description CTF1 (start) SRF1 (start) CTF0 (stop) SRF0 (stop) Skip if CTF = 1 Skip if SRF = 1 PCa6 PCa12 PCa13 STPC + 1, PC2a, SPSP - 4 STPC + 2, PCa12, SPSP - 4 PCST, SPSP + 4 PCST, SPSP + 4, Unconditional skip PC(PCA) + 1 PC(M(w), A) AP APp PA PpA No operation Halt CPU Stop clock
ECT ESR DCT DSR TCT TSR JCP a6 JP a12 LJP a13 CZP a CAL a12 RT RTS JA JM
Branch Input/Output CPU control
IP IPD p OP OPD p NOP HALT STOP
Notes: a m n p
: : : :
ROM address data RAM address data Immediate data Port address data
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Semiconductor
MSM6408
ABSOLUTE MAXIMUM RATINGS
Parameter Power Supply Voltage Input Voltage Output Voltage Power Dissipation Storage Temperature Symbol VDD VI VO PD TSTG Ta = 25C per package Ta = 25C per output -- Ta = 25C Condition Rating -0.3 to +7 -0.3 to VDD -0.3 to VDD 200 50 -55 to +150 Unit V V V mW mW C
RECOMMENDED OPERATING CONDITIONS
Parameter Power Supply Voltage Data-Hold Voltage Operating Temperature Fan Out Symbol VDD VDDH Top N Condition fOSC 1 MHz fOSC 4.0 MHz fOSC = 0 Hz -- MOS load TTL load Range 3 to 6 4.5 to 5.5 2 to 6 -40 to +85 15 1 Unit V V V C --
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Semiconductor
MSM6408
ELECTRICAL CHARACTERISTICS
DC Characteristics
(VDD = 5 V 10%, Ta = -40 to +85C) Parameter "H" Input Voltage "H" Input Voltage "L" Input Voltage "H" Output Voltage "L" Output Voltage "L" Output Voltage Input Current Input Current "H" Output Current "H" Output Current Input Capacitance Output Capacitance Power Supply Current (In Stopped State) Power Supply Current *1,*5 *1 *5 *3 *2,*4 *1 *1 *1,*2 *3,*4 Symbol VIH VIH VIL VOH VOL VOL IIH/IIL IIH/IIL IOH IOH CI CO IDDS IDD Condition -- -- -- IO = -15 mA IO = 1.6 mA IO = 15 mA VI = VDD/0 V VI = VDD/0 V VO = 2.4 V VO = 0.4 V f = 1 MHz, Ta = 25C VDD = 2 V, no load, Ta = 25C No load Crystal oscillation f = 4 MHz, no load Min. 2.4 3.6 -0.3 4.2 -- -- -- -- -0.1 -- -- -- -- -- -- Typ. -- -- -- -- -- -- -- -- -- -- 5 7 0.2 1 6 Max. VDD VDD +0.8 -- 0.4 0.4 15/-15 1/-30 -- -1.2 -- -- 5 100 12 Unit V V V V V V mA mA mA mA pF mA mA mA
*1 *2 *3 *4 *5
Applied to P0, P1, P3, P4, P5, P6, P7 and P8 Applied to P2 Applied to OSC0 Applied to RESET Applied to OSC1
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Semiconductor AC Characteristics
MSM6408
(VDD = 5 V 10%, Ta = -40 to +85C) Parameter Clock (OSC0) Pulse Width Cycle Time Input Data Setup Time Input Data Hold Time SR/TM Clock Pulse Width CT Clock Pulse Width P2 Input Data Clock Pulse Width SR Data Setup Time SR Data Hold Time Data Delay Time Data Delay Time at Mode Switching Data Delay Time at OPT Instruction Data Delay Time at OPT Instruction CT/TM Data Delay Time Using TBC Clock SR/TM Data Delay Time Using PORT Clock CT Data Delay Time Using PORT Clock CT Data Delay Time Using External Clock SR/TM Data Delay Time Using External Clock SR Clock Invalid Time INT Invalid Time Symbol tfW tCY tDS tDH tWS/tWT tWC tWP tSS tSH tDR tDCR tDI1 tDI2 tCT/tTT tSR/tTR tCR tCP tSP/tTP tSINH tIINH Condition -- -- -- -- -- -- -- -- -- CL = 15 pF CL = 15 pF CL = 15 pF CL = 15 pF CL = 15 pF CL = 15 pF CL = 15 pF CL = 15 pF CL = 15 pF -- -- Min. 125 1 120 120 120 2/8 tCY + 120 120 120 120 -- -- -- -- -- -- -- -- -- 2/8 tCY 1/8 tCY Typ. -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Max. -- -- -- -- -- -- -- -- -- tCY + 300 7/8 tCY + 300 6/8 tCY + 300 7/8 tCY + 300 2/8 tCY + 360 tCY + 480 10/8 tCY + 480 2/8 tCY + 360 360 -- -- Unit ns ms ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
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Semiconductor Timing Diagrams Output Conditions
1MC
MSM6408
OSC0 tCY P0, P1, P3 0, 1, 3 P4, P5, P6 PA = 4, 5, 6 7 or 8 P7, P8 P0.1 P0.2 P1.1
tDR
PA = 9 or A tDCR
P4
OPT INST. tDI1
P5
OPT INST. tDI2
CT P0.1 TBC clock TM P1.1 tCT tTT P0.2 P0.1 clock*SR P1.1 P1.2 clock*TM tSR tTR P0.1 P1.0 clock*CT tCR P0.1 EXT clock
P1.0 P1.2 EXT clock
P0.1 CT tCP P0.2 SR P1.1 TM tSP tTP
*
Output data to port is clock for SR, TM or CT. 13/19
Semiconductor Input Conditions
1MC
MSM6408
OSC0 tfW P0, P1, P2 P3, P4, P5 P6, P7, P8 tfW INPUT DATA tDS tDH
P0.1 SR clock P1.2 TM clock P2 P1.0 CT clock
tDW1
tDW2
P0.1 SR clock
P0.3 SI
INPUT DATA tSS tSH
1MC
OSC0 tIINH tSINH
tSINH : P0.1 (SR clock) INH period during LMSR INST. (Note: P0.1 is used for clock of SR.) tIINH : P2.0 (interrupt) INH period during RPB and RPBD INST.
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Semiconductor Operating Characteristics Typ. Current (IOH) vs Voltage (VOH) for High State Output
-1.0 -0.9 -0.8 -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1 0 Ta = 25C
MSM6408
Typ. Current (IOL) vs Voltage (VOL) for Low State Output
Ta = 25C 20 VDD = 5 V 6V 18 16 14 4V 12 10 8 3V 6 4 2 0 0 1 2 3 4 5 6 7 8 9 10 VOL (V)
IOH (mA)
5V 4V 3V
0 1 2 3 4 5 6 7 8 9 10 VOH (V)
Typ. Maximum Oscillator Frequnecy (fOSC) vs Supply Voltage (VDD)
10 9 8 7 6 5 4 3 2 1 0 Ta = 25C, CL = 15 pF
Typ. Maximum Oscillator Frequnecy (fOSC) vs Temperature (Ta)
10 9 8 7 6 5 4 3 2 1 0 CL = 15 pF
IOL (mA)
VDD = 6 V
fOSC (MHz)
0 1 2 3 4 5 6 7 8 9 10 VDD (V)
fOSC (MHz)
VDD = 5 V
-40 -20 0 20 40 60 80 100 120 Ta (C)
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Semiconductor Operating Characteristics (continued) Typ. Supply Current (IDD) vs Supply Voltage (VDD)
10 m Ta = 25C, no load fOSC = 4 MHz 2 MHz 1 MHz 500 kHz 100 kHz
MSM6408
1m
100 m
IDD (A)
10 m
0 Hz 1m
100 n
0 1 2 3 4 5 6 7 8 9 10 VDD (V)
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Semiconductor
MSM6408
PACKAGE DIMENSIONS
(Unit : mm)
DIP42-P-600-2.54
Package material Lead frame material Pin treatment Solder plate thickness Package weight (g)
Epoxy resin 42 alloy Solder plating 5 mm or more 6.20 TYP.
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Semiconductor
MSM6408
(Unit : mm)
QFP44-P-910-0.80-K
Mirror finish
Package material Lead frame material Pin treatment Solder plate thickness Package weight (g)
Epoxy resin 42 alloy Solder plating 5 mm or more 0.35 TYP.
Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki's responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times).
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Semiconductor
MSM6408
(Unit : mm)
QFP44-P-910-0.80-2K
Mirror finish
Package material Lead frame material Pin treatment Solder plate thickness Package weight (g)
Epoxy resin 42 alloy Solder plating 5 mm or more 0.41 TYP.
Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki's responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times).
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